Semiconductor News & Analysis Feed
26 articles
2026-07-08
eetimes.com
2026-07-08
This white paper describes the critical engineering and strategic pain points behind today’s AI data center infrastructure gap and offers practical frameworks for resolving them. Whether you’re architecting a new hyperscale facility or expanding or hardening an existing one, here you’ll find the technical and business insights you need to make smarter, more effective infrastructure […]
2026-07-07
finance.yahoo.com
2026-07-07
Yahoo Finance
2026-07-07
blogs.nvidia.com
2026-07-07
NVIDIA Blog
2026-07-06
digitimes.com
2026-07-06
Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed by internal production claims for Kirin chips and Ascend accelerators. Despite that, he also drew caution because the work remains a preprint, not a peer-reviewed study.
2026-07-04
www.marktechpost.com
2026-07-04
MarkTechPost
2026-06-30
eetimes.com
2026-06-30
MCP gives enterprise AI a common, open plumbing layer to connect models with tools, data, and agents.
2026-06-26
tomshardware.com
2026-06-26
Hassam Nasir
A small victory in the face of a gargantuan problem.
2026-06-23
digitimes.com
2026-06-23
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development plan to strengthen the country's position in the global chip supply chain.
2026-06-15
semiengineering.com
2026-06-15
Semiconductor Engineering
Researchers from Politecnico di Torino and CEA-List published a technical paper titled “InjectV: Modeling Fault Injection Attacks in RISC-V Simulation Environment.”
“Fault Injection Attacks (FIAs) are a significant threat to hardware security, capable of compromising systems by inducing malicious faults in computation or storage. Evaluating resilience against such attacks is challenging due to th
2026-06-04
quantumcomputingreport.com
2026-06-04
Quantum Computing Report
Infineon Technologies AG has integrated its OPTIGA™ Trusted Platform Module (TPM) SLB 9672 with NVIDIA’s Jetson Thor processing platform. Designed to isolate cryptographic assets and monitor system state parameters at the silicon level, the hardware module serves as a certified root of trust for robotics and Physical AI systems. The architecture provides robotic fleet operators with cryptographic
2026-06-03
www.indexbox.io
2026-06-03
IndexBox
BRUSSELS - On June 3, 2026, the European Commission unveiled the European Chips Act 2.0, a significant advancement in Europe's drive to boost semiconductor competitiveness, resilience, and technological autonomy. The policy was introduced at the SEMI Europe Policy Forum in Brussels, a high-profile event organized by SEMI Europe that gathered leading figures from the semiconductor sector, policymak
2026-06-03
pv-magazine-usa.com
2026-06-03
pv magazine USA
Anew reference design to support fast deployment of AI infrastructure with battery energy storage system (BESS) support has been developed by Siemens, Nvidia and Fluence.
Siemens announced the new DSX Vera Rubin AI factory reference design has been created to support the deployment of high energy density data centers.
Power densities in data centers are expected to increase significantly as the
2026-06-02
www.thestandard.com.hk
2026-06-02
The Standard (HK)
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2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-28
digitimes.com
2026-05-28
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something more consequential: an emerging gatekeeping system for AI computing infrastructure.
2026-05-28
digitimes.com
2026-05-28
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems.
2026-05-27
digitimes.com
2026-05-27
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure.
2026-05-26
www.digitimes.com
2026-05-26
digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activa
2026-05-26
www.digitimes.com
2026-05-26
digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activa
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.