Semiconductor News & Analysis Feed

The surge in demand for AI and HPC devices is driving the semiconductor industry toward panel-level packaging (PLP) to accommodate increasingly large chip sizes. HDFO panel packaging requires higher RDL layer counts, increased micropillar height, and reduced trace and bump pitches, posing new challe

ASE Technology has unveiled its latest high-density fan-out packaging solution, FOCoS, tailored for AI and data center processors facing increasing bandwidth and power demands. The FOCoS module integrates multiple logic dies and high-bandwidth memory (HBM) on a single advanced substrate, enabling sh