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2026-05-04
The competition in advanced packaging technology is intensifying! Intel's EMIB-T yield has reached 90%, potentially to be used in Google’s next-generation TPU. - Moomoo
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www.moomoo.com 2026-05-04 Moomoo
2026-05-04
NVIDIA RTX PRO 1000 Blackwell Generation Laptop - Notebookcheck
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www.notebookcheck.net 2026-05-04 Notebookcheck
2026-05-04
Exclusive: Backed by a TSMC CoWoS Veteran, MediaTek Targets Google and Broadcom - 天下雜誌
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english.cw.com.tw 2026-05-04 天下雜誌
2026-05-01
How to Build Obsolescence‑Resistant Systems in an Era of Rapid Tech Change
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eetimes.com 2026-05-01
Proactively manage semiconductor obsolescence with early insights and trusted partners to avoid redesigns and keep your supply chain secure.
Semiconductor ObsolescenceSystem DesignSupply Chain ManagementAutomotive ElectronicsAvionicsDefense ElectronicsLong LifecycleComponent End-of-Life
2026-04-23
Telecom Industry Bets on Automation to Tackle AI Squeeze
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eetimes.com 2026-04-23 Pablo Valerio
The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.
Telecom IndustryArtificial IntelligenceSemiconductor Supply ChainAutomationCapital Expenditure5G6GChip Costs
2026-04-09
Intel Enters Pact With Tesla and SpaceX for Terafab
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eetimes.com 2026-04-09 Pablo Valerio
“Terafab is likely an Intel fab expansion, with Tesla, SpaceX, and xAI as anchor customers, rather than a standalone venture,” said Yole analyst Adrien Sánchez.
Semiconductor ManufacturingChip DesignAI ChipsTerafab ProjectIntel PartnershipTeslaSpaceXAI Infrastructure
2026-04-01
Alibaba Launches XuanTie C950 CPU for Agentic AI
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eetimes.com 2026-04-01 Pablo Valerio
Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape.
AlibabaXuanTie C950RISC-VAgentic AISemiconductorChip DesignAI AcceleratorTechnological Sovereignty