Semiconductor News & Analysis Feed
2936 articles
2026-05-29
finimize.com
2026-05-29
Finimize
The chip designer says it supports both TSMC’s CoWoS and Intel’s EMIB as it targets $2 billion of 2026 data center revenue.
MediaTek, a Taiwanese chip designer best known for smartphone processors, says it can package custom AI data-center chips using either TSMC’s CoWoS or Intel’s EMIB, giving customers two routes to get to mass production.
“Advanced packaging” is the step that connects multipl
2026-05-29
tomshardware.com
2026-05-29
Mark Tyson
An IBM ThinkPad user boasts that they can install '(almost) all versions of Windows from NT 4 to 10 22H2' with driver support, without resorting to virtual machine (VM) technology.
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
__fail__
2026-05-29
tomshardware.com
2026-05-29
Jowi Morales
It also features a software stack that could potentially allow it to operate as a singular unit with drones operating in the air, on the land, and on the surface.
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__
2026-05-29
news.google.com
2026-05-29
Yahoo Finance Singapore
2026-05-29
ca.finance.yahoo.com
2026-05-29
Yahoo News Canada
__fail__
2026-05-29
tomshardware.com
2026-05-29
Etiido Uko
Malware avoids detention by monitoring GPU usage and shutting down during heavy activity
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__
2026-05-29
www.investing.com
2026-05-29
Investing.com
__fail__
2026-05-29
www.aljazeera.com
2026-05-29
Al Jazeera
Chip maker becomes second South Korean company in history to hit milestone.
South Korea’s SK Hynix has entered the exclusive ranks of companies worth at least $1 trillion, propelled by explosive demand for semiconductors used in AI.
SK Hynix, the world’s second-largest memory chip maker, hit the milestone this week as investors rushed to capitalise on record-shattering revenues generated by the
2026-05-29
asia.nikkei.com
2026-05-29
Nikkei Asia
Move a win for US chip titan as it looks to secure customers for foundry services
Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters)
TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__
2026-05-29
www.neowin.net
2026-05-29
Neowin
www.neowin.net
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a033f9a94cc005bc
Performance and Security by Cloudflare
Privacy
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
__fail__
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__
2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
kfgo.com
2026-05-29
KFGO
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its