Semiconductor News & Analysis Feed

AI streamlines verification by targeting repetitive tasks but can't replace expert signoff.

Redesign your AI systems for efficiency—escape the DRAM crunch by embracing smaller, smarter models.

Keith Basil, edge strategy and product leader at SUSE, outlines how the Losant acquisition shapes SUSE Industrial Edge and its deployment model.

The gap between lab performance and fab reality is growing wider as packages grow more ...

The semiconductor industry is facing a reckoning it has postponed for years.

EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.

BSC and UPC launch a spin-off creating auditable processor architecture for European critical infrastructure.

Unpack the $402B semiconductor foundry industry myths—discover who really dominates and why global alliances drive the chips in your life.

As the Nexperia episode sharpens Europe’s focus, experts say resilience will hinge on application relevance, supply chain depth, and smarter investment priorities.

Why transatlantic execution, not transatlantic symbolism, now matters to the electronics and semiconductor supply chain.

Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape.

The economics of the global memory market are being fundamentally rewritten by the AI supercycle and catastrophic Middle East supply disruptions.

Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial subsidies. The database tracks support received by 525 of the world's largest manufacturing groups across 15 industrial sectors from 2005 to 2024.

Samsung Electronics is facing a new shift in labor relations after the Samsung Electronics branch of the Samsung Group Super-Enterprise Union reportedly lost its status as a majority union following a sharp drop in membership after bonus negotiations. The move weakens the union's representation and could further fragment future labor talks and union power at Samsung Electronics.

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se

Industrial factories are likely to become the first major market for robots at scale, according to Rafael Sotomayor, NXP President and CEO, who said manufacturers want stable systems, dependable performance, and clear financial returns. This view suggests that the earliest gains from robotics may come in places where efficiency improvements are easiest to measure.

As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race.