Semiconductor News & Analysis Feed
911 articles
2026-06-30
digitimes.com
2026-06-30
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.
2026-06-30
digitimes.com
2026-06-30
Micron's latest earnings call pointed to a broader AI shift that could reshape memory demand far beyond data centers, with investors taking note of the company's comments on robots, autonomous vehicles, and other physical systems. The message suggested that the next leg of growth may come from devices that bring AI into the real world.
2026-06-30
digitimes.com
2026-06-30
Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMESanalyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.
2026-06-30
digitimes.com
2026-06-30
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
2026-06-30
digitimes.com
2026-06-30
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a re
2026-06-30
digitimes.com
2026-06-30
Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft, and Nintendo all having signaled product price increases as widening supply-demand gaps continue to drive up memory costs.
2026-06-30
digitimes.com
2026-06-30
Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten to raise hardware expenses just as the company pushes deeper into on-device AI.
2026-06-30
digitimes.com
2026-06-30
Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products
2026-06-30
tomshardware.com
2026-06-30
Hassam Nasir
Valve has asked Dbrand to stop selling its Portal 2-themed Companion Cube cases for the Steam Machine, since it never asked the company permission to begin with.
2026-06-29
finance.yahoo.com
2026-06-29
Yahoo Finance
Micron Extorts the Supply Chain to Leave Apple Carrying the Consumer Backlash
Alex Sirois
June 29, 2026 3 min read
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Micron's 84.9% gross margin towers over Apple's 46.9%, exposing which side of the supply chain holds AI-era pricing power.
Sanjay Mehrotra locked in 16 customer agreements worth ~$100 billion
2026-06-29
247wallst.com
2026-06-29
24/7 Wall St.
Micron Technology (NASDAQ: MU | MU Price Prediction) and Apple (NASDAQ: AAPL) just reported earnings that expose who holds the AI era’s supply chain leverage. Micron posted a record fiscal Q3 with an 84.9% non-GAAP gross margin. Apple delivered its best March quarter ever at $111.184 billion while flagging reliance on third parties for components as a core risk.
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HBM Inhales Wafers. iP
2026-06-29
finance.yahoo.com
2026-06-29
Yahoo Finance
NN Shares Soar After Winning New NVIDIA AI Data Centre Contracts (NNBR)
Fiona Craig
June 29, 2026 2 min read
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Servers in a data centre ©Shutterstock
NN, Inc. (NASDAQ:NNBR) shares surged 68% on Monday after the precision engineering company announced a series of new multi-year contract awards to supply liquid cooling components for
2026-06-29
timesofindia.indiatimes.com
2026-06-29
The Times of India
The TOI Tech Desk is a dedicated team of journalists committed to delivering the latest and most relevant news from the world of technology to readers of The Times of India. TOI Tech Desk’s news coverage spans a wide spectrum across gadget launches, gadget reviews, trends, in-depth analysis, exclusive reports and breaking stories that impact technology and the digital universe. Be it how-tos or th
2026-06-29
www.benzinga.com
2026-06-29
Benzinga
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2026-06-29
siliconcanals.com
2026-06-29
Silicon Canals
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2026-06-29
digitimes.com
2026-06-29
China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project for ultra-wide-bandgap semiconductor materials set to be built in Zhengzhou. The project aims to strengthen domestic capabilities in diamond-based semiconductor materials for AI chips, advanced communications and electric vehicles, while expanding China's presence beyo
2026-06-29
digitimes.com
2026-06-29
Samsung Electronics chairman Lee Jae-yong said Gwangju is being considered as a candidate site for Samsung's next semiconductor complex, lending corporate backing to South Korea's plan to build a second chip production base in Gwangju and the broader Jeolla region in the country's southwest.
2026-06-29
digitimes.com
2026-06-29
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers also expect Samsung to expand 1c DRAM production for HBM4 while raising the latter's prices in 2027 to boost both market share and profitability.
2026-06-29
digitimes.com
2026-06-29
Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong public offering. The company is also asking investors to commit to buying its chips as a condition of participation, according to The Information, underscoring the competitive dynamics shaping chip makers as Beijing moves to strengthen its domestic AI supply chain.
2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.