Semiconductor News & Analysis Feed

As the semiconductor industry advances toward higher-layer HBM technologies, Samsung has filed a new patent aimed at enhancing the reliability of high-stack memory packaging. The patent focuses on addressing warpage issues in the topmost dummy die of HBM stacks with 12 or more layers, which signific

Samsung Electronics has filed a patent aimed at addressing reliability issues in high-bandwidth memory (HBM) stacks as they grow taller. The patent focuses on the 'dummy die' that caps the memory stack—though it performs no computational function, it plays a critical role in structural support and h