www.trendforce.com
2026-07-02
TrendForce
[News] Samsung Files New HBM Dummy Die Patent to Enhance High-Stack Reliability; Seen as Aimed at 16-Layer HBM5
2026-07-02 Semiconductors editor
News
Please note that this article cites information from ETNews.
As the industry advances toward higher-layer HBM, Samsung is reportedly developing a new structural design to improve package reliability. According to ETNews, Samsung Electronic
www.techtimes.com
2026-07-01
Tech Times
By Allen Lee
Published: Jun 30 2026, 4:16 PM EDT
Share on Facebook
Share on Twitter
Share on LinkedIn
Share on Reddit
Share on Flipboard
Share on Pocket
SEMICONDUCTOR.SAMSUNG.COM
Samsung Electronics has filed a patent aimed at the reliability problems that crop up as high-bandwidth memory (HBM) stacks grow taller — reworking the "dummy die" that caps the stack to improve yield and stability ahea