Semiconductor News & Analysis Feed
315 articles
2026-06-17
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2026-06-17
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Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
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2026-06-16
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2026-06-16
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Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are...
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2026-06-16
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2026-06-16
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ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and...
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2026-06-16
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2026-06-16
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Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor...
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
digitimes
On June 15, Synopsys celebrated the 35th anniversary of its Taiwan operations and officially opened its new office at Hsinchu Science Park X Software Park.
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2026-06-16
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2026-06-16
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Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible through Synopsys' Ansys HFSS and Ansys Icepak environments, simplifying engineers' workflows as they develop increasingly...
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2026-06-16
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2026-06-16
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The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
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2026-06-16
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TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
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2026-06-16
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Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
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2026-06-16
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2026-06-16
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that was just Apple's messaging. Most on-device AI features only need 8GB of memory; only the Apple-defined advanced on-device AI requires the higher 12GB spec.
2026-06-16
www.digitimes.com
2026-06-16
digitimes
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had...
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that was just Apple's messaging. Most on-device AI features only need 8GB of...
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2026-06-15
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2026-06-15
digitimes
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea, and...
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2026-06-15
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2026-06-15
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Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion market-cap mark for the first time. That shift has also drawn global attention...
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2026-06-15
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2026-06-15
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Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and...
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2026-06-15
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2026-06-15
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As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes...
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2026-06-15
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2026-06-15
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The Supreme People's Court in China rejected Infineon's reconsideration request on June 12, 2026, upholding a Suzhou Intermediate People's Court injunction that found Infineon had infringed two of InnoScience's core GaN invention patents. The ruling bars the...
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2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
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SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
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