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Trending Technologies
Maia 3006 HBM4 AI4 GeForce RTX 50904 AI factories3 USFP3 2D Semiconductors2 RTX GPU2 Data Center2 OCP2 pluggable optics2 CXL 3.22
2026-10-07
DIGITIMES Insight: HBM expansion raises the bar for memory offload
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digitimes.com 2026-10-07
2026-10-07
DIGITIMES Insight: AI servers will carry nearly twice as many CPUs per accelerator by 2027
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digitimes.com 2026-10-07
2026-10-02
Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives - digitimes
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news.google.com 2026-10-02
2026-10-02
Micron ramps up HBM capacity at Taiwan's four major sites - digitimes
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www.digitimes.com 2026-10-02
2026-10-02
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities - digitimes
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www.digitimes.com 2026-10-02
2026-10-02
Micron eyes NVHBM profits with TSMC custom HBM push - digitimes
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www.digitimes.com 2026-10-02
2026-10-02
JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists - digitimes
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www.digitimes.com 2026-10-02
JSR's completion of its dedicated EUV photoresist facility in South Korea's Ochang Foreign Investment Zone represents a pivotal step in the broader localization strategy of Japanese semiconductor materials suppliers. The move is best understood not as a simple capacity expansion but as a structural
PhotoresistEUV LithographySemiconductor MaterialsSupply Chain LocalizationJapan SemiconductorSouth Korea SemiconductorJSRNext-Gen Resists
2026-10-02
JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists - digitimes
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www.digitimes.com 2026-10-02
2026-10-02
Onsemi revises Synaptics takeover deal after rival bid - digitimes
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www.digitimes.com 2026-10-02
Onsemi's decision to amend its all-cash acquisition of Synaptics in response to a rival bid signals a pivotal moment in the semiconductor industry's ongoing consolidation. Rather than a straightforward deal revision, this event underscores the intense strategic competition for Synaptics' touch, sens
M&AOnsemiSynapticsRival BidSemiconductorTouch ICAutomotive ElectronicsSupply Chain
2026-10-02
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
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digitimes.com 2026-10-02
2026-10-01
Infineon opens new backend chip plant in Thailand, eyes growth to up to five modules - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
Synopsys and OpenAI to share revenue from AI model built to run chip design tools - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
Samsung Foundry gets boost from HBM4 as 2nm push continues - digitimes
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www.digitimes.com 2026-10-01
2026-10-01
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
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digitimes.com 2026-10-01
2026-09-30
Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use - digitimes
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www.digitimes.com 2026-09-30
2026-09-30
Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future - digitimes
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www.digitimes.com 2026-09-30