finance.biggo.com
2026-08-11
Siliconware Precision Industries (SPIL), a leading global semiconductor packaging and testing company and subsidiary of ASE Technology Holding (3711-TW), held a groundbreaking ceremony for its new Douliu plant in Yunlin Industrial Park on August 11, announcing an investment of nearly NT$100 billion
www.ad-hoc-news.de
2026-06-16
TSMC's CoWoS (chip-on-wafer-on-substrate) advanced packaging technology is at the heart of the AI accelerator boom. As hyperscalers ramp up AI infrastructure investments, demand for CoWoS capacity has outpaced supply, prompting TSMC to aggressively expand its production capabilities over the next tw