Semiconductor News & Analysis Feed

8 articles
2026-07-02
www.digitimes.com 2026-07-02 digitimes
2026-07-01
digitimes.com 2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-06-26
digitimes.com 2026-06-26
Qualcomm used its Investor Day to formally launch Dragonfly, a new data center product line aimed at cloud AI, and set out an ambitious revenue path that would shrink its dependence on handset sales. The company said the plan could reshape its business mix by 2029, but it still faces questions over timing, product performance, and execution.
2026-06-18
www.thefastmode.com 2026-06-18 The Fast Mode
HPE announced new innovations to help customers transform into agentic enterprises and move AI into production with greater security, governance, and control. These new offerings transform the HPE AI Factory with NVIDIA for the next era of AI where intelligence adapts, evolves, collaborates, and governs. Secure and governed agentic AI gives enterprises the controls needed to move agents from deve
2026-06-17
www.hpcwire.com 2026-06-17 HPCwire
www.hpcwire.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a0d29b25be65f5ca Performance and Security by Cloudflare Privacy
2026-06-13
digitimes.com 2026-06-13
As cloud service providers ramp up investment in AI infrastructure, Edom chairman Wayne Tseng said rising costs for materials, production equipment and labour will keep overall market supply tight in the second half of 2026, with price increases likely to continue. He also said AI is moving from the cloud into enterprise applications, with power, cybersecurity, optics and the medical sector set to
2026-06-12
digitimes.com 2026-06-12
Broadcom has acknowledged it will not win all of Google's TPU orders, highlighting how tensor processing units have become a competitive arena for multiple chipmakers. For global readers, the shift signals a broader race for cloud AI supply, capacity, and influence, as more firms vie for a share of high-value custom chip demand.
2026-06-11
digitimes.com 2026-06-11
Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for the cloud AI connectivity chip supplier as demand grows for scale-up infrastructure in AI clusters.