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2026-10-01
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
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digitimes.com 2026-10-01
2026-10-01
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
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digitimes.com 2026-10-01
2026-10-01
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
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digitimes.com 2026-10-01
2026-09-30
CoWoS-L to Remain Leading AI Chip Packaging Technology Through 2028 - EE Times Asia
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news.google.com 2026-09-30
2026-09-29
AI demand drives $100 billion inflection in advanced chip packaging - ET Datacenters
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datacenters.economictimes.indiatimes.com 2026-09-29
2026-09-21
AU Optronics And Intel Could Reshape Chip Packaging, Merging Micro LED Displays With Silicon & CPOs To Chase AI Demands - wccftech.com
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wccftech.com 2026-09-21
2026-09-19
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028 - TechPowerUp
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www.techpowerup.com 2026-09-19
2026-09-18
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028, Says TrendForce - TrendForce
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www.trendforce.com 2026-09-18
2026-09-17
Charts: Taiwan's chip packaging growth runs deeper than ASE
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digitimes.com 2026-09-17
2026-09-11
Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
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digitimes.com 2026-09-11
2026-09-09
Synopsys, Singapore's A*STAR to cooperate in advanced chip packaging, AI simulation - TNGlobal
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technode.global 2026-09-09
2026-09-09
Synopsys & ASTAR Join Forces to Advance Next-Gen Chip Packaging - asiabusinessoutlook.com
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www.asiabusinessoutlook.com 2026-09-09
2026-09-07
Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging
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digitimes.com 2026-09-07
2026-09-03
LCY Advanced Materials launches wet chemicals for AI chip packaging
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digitimes.com 2026-09-03
2026-08-27
SK hynix launches Indiana chip packaging hub for first US-made HBM - The Korea Herald
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www.koreaherald.com 2026-08-27
SK Hynix's establishment of a chip packaging facility in Indiana represents a significant milestone in US semiconductor supply chain development. The facility will produce high-bandwidth memory (HBM), a critical component for high-performance computing and AI applications. This investment aligns wit
Chip PackagingSemiconductor ManufacturingUS Semiconductor IndustrySK HynixHBM MemoryIndianaSemiconductor InvestmentSupply Chain Localization
2026-08-27
SK Hynix starts construction of first HBM chip packaging plant in US - Nikkei Asia
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asia.nikkei.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Forth.News
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www.forth.news 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - The Mighty 790 KFGO
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kfgo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - KELO-AM
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kelo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WKZO
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wkzo.com 2026-08-27