Semiconductor News & Analysis Feed
4355 articles
2026-06-25
www.cnn.com
2026-06-25
CNN
A number of Apple products, including the MacBook Neo, got price increases Thursday. Adam Gray/Bloomberg/Getty Images
New York —
Apple has hiked prices on some of its most popular products, including the MacBook and iPad, because of the rising costs of memory and storage chips sparked by the AI boom.
Beginning immediately, the price increases affect the Neo, its entry level MacBook that’s now
2026-06-25
www.datacenterknowledge.com
2026-06-25
Data Center Knowledge
IBM’s NanoStack transistor platform promises to extend chip scaling beyond nanosheets, offering improvements in AI performance, memory density, and energy efficiency.
IBM has developed what it calls the world’s first sub-1-nanometer semiconductor technology, unveiling a new transistor architecture designed to extend chip scaling as AI workloads drive demand for more compute and greater energy eff
2026-06-25
finimize.com
2026-06-25
Finimize
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2026-06-25
cybernews.com
2026-06-25
Cybernews
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2026-06-25
www.streetinsider.com
2026-06-25
StreetInsider
www.streetinsider.com
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2026-06-25
www.whalesbook.com
2026-06-25
Whalesbook
Apple has increased prices for its iPad and MacBook lineups by up to $300 as memory and storage chip costs rise. Driven by intense AI datacenter demand, this component shortage is squeezing hardware profit margins and may signal a cooling trend for consumer electronics sales. This shift marks a significant challenge for global tech manufacturers struggling with soaring material costs.
What Happen
2026-06-25
www.hpcwire.com
2026-06-25
HPCwire
www.hpcwire.com
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2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
bits-chips.com
2026-06-25
Bits&Chips
Headline
Japanese researcher proposes simpler high-NA EUV optics design
25 June 2026
Paul van Gerven
Editor at Bits&Chips
Reading time: 1 minute
A researcher at the Okinawa Institute of Science and Technology (OIST) has proposed a new optical architecture for high-NA EUV lithography. The approach replaces today’s highly complex optical layouts with a simpler in-line configuration that uses carefu
2026-06-25
www.msn.com
2026-06-25
MSN
Tech giants raise prices: Apple and Microsoft have increased prices on Macs, iPads and Xbox consoles due to unprecedented memory and storage cost spikes.
AI demand squeezes supply: AI data centre expansion has driven memory shortages, with DRAM prices up 98% in Q1 2026 and more increases expected.
Apple shifts chip plans: Reports suggest Apple will skip M6 Pro and Max chips, moving directly to A
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
siliconangle.com
2026-06-25
SiliconANGLE
Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so they can build the extremely complex 3D architectures necessary for the next generation of artificial intelligence processors.
To do this, it has unveiled a host of new chip fabrication systems that span advanced packaging, process control and dynamic-random access memory m
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
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Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
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Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
news.google.com
2026-06-25
Stock Titan
2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
za.investing.com
2026-06-25
Investing.com South Africa
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2026-06-25
ca.investing.com
2026-06-25
Investing.com Canada
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2026-06-25
www.investing.com
2026-06-25
Investing.com
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2026-06-25
tomshardware.com
2026-06-25
Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
www.fastcompany.com
2026-06-25
Fast Company
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