Semiconductor News & Analysis Feed
7409 articles
2026-06-30
digitimes.com
2026-06-30
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
2026-06-30
digitimes.com
2026-06-30
Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.
2026-06-30
digitimes.com
2026-06-30
Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.
2026-06-30
digitimes.com
2026-06-30
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.
2026-06-30
digitimes.com
2026-06-30
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.
2026-06-30
digitimes.com
2026-06-30
Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products
2026-06-30
digitimes.com
2026-06-30
Protecting patents around the world is a core value for any R&D-driven company. It is also a commitment to partnering with customers. In 2025, glass giant Corning filed nearly 400 patent applications and close to 1,000 international applications. Its active patent portfolio now totals around 11,400 patents worldwide.
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-30
digitimes.com
2026-06-30
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a re
2026-06-30
digitimes.com
2026-06-30
Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for AI servers, while also expanding substrate production capacity and securing a separate silicon capacitor contract, according to Korean media reports and company statements.
2026-06-30
digitimes.com
2026-06-30
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.
2026-06-30
digitimes.com
2026-06-30
Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMESanalyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.
2026-06-30
digitimes.com
2026-06-30
South Korea's inventories of high-purity carbon dioxide, a critical material used in advanced semiconductor manufacturing, have fallen below normal buffer levels, raising procurement concerns across the chip industry, according to The Elec.
2026-06-30
digitimes.com
2026-06-30
China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft, and Nintendo all having signaled product price increases as widening supply-demand gaps continue to drive up memory costs.
2026-06-30
digitimes.com
2026-06-30
The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are rising, demand is hard to gauge, and companies are preparing for customer stockpiling that could keep chip orders elevated into the third quarter.
2026-06-30
www.reuters.com
2026-06-30
Reuters
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2026-06-30
finance.yahoo.com
2026-06-30
Yahoo Finance
China's Nexchip Semiconductor seeks up to $890.3 million in Hong Kong share sale
Illustration picture of semiconductor chips on a circuit board · Reuters
Reuters
June 29, 2026 1 min read
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June 30 (Reuters) - China's Nexchip Semiconductor seeks to raise up to HK$6.98 billion ($890.26 million) in a Hong Kong sh
2026-06-30
news.google.com
2026-06-30
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