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2026-06-17
Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit
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eetimes.com 2026-06-17
Imec’s Zsolt Tokei and Arm’s Mohamed Awad explain why CMOS 2.0 could redefine semiconductor scaling beyond chiplets.
transistor scaling3D integrationchip stackingCMOS 2.0advanced packagingAI hardwarehigh-bandwidth memoryheterogeneous integration
2026-06-17
Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit - EE Times
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news.google.com 2026-06-17 EE Times