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2026-05-28
Infineon CoolGaN BDS Chips Splash Portable Power Footprint by 82% - ELE Times
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www.eletimes.ai 2026-05-28 ELE Times
Search ELE Times Search HomeIndustryConsumerInfineon CoolGaN BDS Chips Splash Portable Power Footprint by 82% Electronics Semiconductors and Chips Industry Consumer News World News Infineon CoolGaN BDS Chips Splash Portable Power Footprint by 82% ELE Times News May 28, 2026 Infineon-CoolGaN Infineon Technologies AG expands its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new dev
InfineonGaN chipCoolGaNpower switchportable devicePCB footprint reductionbidirectional switchfast charging
2026-05-26
Infineon expands CoolGaN BDS family - Electronics Weekly
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www.electronicsweekly.com 2026-05-26 Electronics Weekly
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2026-05-22
Infineon adds devices to CoolGaN BDS 40V G3 family - Semiconductor Today
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www.semiconductor-today.com 2026-05-22 Semiconductor Today
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2026-05-21
Infineon expands CoolGaN BDS portfolio for compact consumer electronics - New Electronics
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www.newelectronics.co.uk 2026-05-21 New Electronics
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2026-05-21
Infineon CoolGaN BDS 40V G3 Cuts Portable Power Design Footprint by Up to 82% - TimesTech
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timestech.in 2026-05-21 TimesTech
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