Semiconductor News & Analysis Feed

2 articles
2026-06-11
www.automotivepowertraintechnologyinternational.com 2026-06-11
ROHM has introduced the TSC3PAK cooling package for SiC MOSFETs, featuring a top-side heat dissipation design that matches the thermal performance of conventional through-hole packages (TO-247-4L) while enabling automated surface-mount assembly. This advancement is particularly beneficial for power
2026-06-11
www.automotivepowertraintechnologyinternational.com 2026-06-11
Texas Instruments (TI) has introduced the BQ79826Z-Q1, a high-channel-count battery monitor with integrated electrochemical impedance spectroscopy (EIS) technology, aimed at enhancing battery monitoring in electric vehicles and energy storage systems. The device supports up to 26 battery cells per u