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Cadence releases new AuraStack AI Super Agent dedicated to PCB and packaging design - My Everyday Tech

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www.myeverydaytech.com 2026-07-31

Cadence has launched its new AuraStack AI Super Agent, tailored for PCB and advanced packaging design. Built on an AI-native platform, it streamlines the entire design cycle from system planning to final product realization. Powered by NVIDIA Blackwell and CUDA-X, the platform coordinates domain-spe

Cadence AI Super Agent PCB Design Packaging Design NVIDIA Blackwell CUDA-X System Design Multiphysics Analysis

Cadence brings agentic AI to PCB and advanced packaging design with AuraStack AI Super Agent - Tech Critter

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www.tech-critter.com 2026-07-31

Cadence introduces AuraStack AI Super Agent, the world’s first agentic AI platform tailored for PCB and advanced packaging design, integrated into Allegro AI Studio. This AI-native solution leverages NVIDIA Blackwell and CUDA-X acceleration to orchestrate multiple domain-specific agents across plann

AI chip design PCB design advanced packaging Cadence NVIDIA agentic AI EDA tools design workflow

Cadence Launches AuraStack AI Super Agent for PCB Design, Advanced Packaging - EE Times India

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news.google.com 2026-07-22

Cadence Launches AuraStack AI Super Agent for PCB Design, Advanced Packaging - EE Times Asia

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news.google.com 2026-07-22

Cadence Unveils AuraStack AI Super Agent for PCB - PlasticsToday

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www.plasticstoday.com 2026-07-17

Cadence launches agentic AI platform AuraStack AI Super Agent - Yahoo Tech

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