Semiconductor News & Analysis Feed

Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.

The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced packaging. The expansion is meant to meet surging global demand for high-compute chips and advanced packaging technology.

Science, Technology and Innovation Minister Datuk Chang Lih Kang (Photo by Zahid Izzani/The Edge) KUALA LUMPUR (July 9): The government is targeting the advanced packaging technology developed through research and development (R&D) projects under the Malaysia Science Endowment (MSE) to be fully commercialised after a two-year capacity-building period, the Dewan Rakyat was told on Thursday. Scien

Access Denied You don't have permission to access "http://www.marketscreener.com/news/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-ra-ce7f5fdad18cfe24" on this server. Reference #18.e4ab3717.1782299657.9548f2b9 https://errors.edgesuite.net/18.e4ab3717.1782299657.9548f2b9

Production-ready 3DI technology supports more compact FEMs for advanced 5G devices MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-pe

gf.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a10a2e668dfef674 Performance and Security by Cloudflare Privacy

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.

__fail__