Semiconductor News & Analysis Feed

1189 articles
2026-05-26
vir.com.vn 2026-05-26 Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.channelnewsasia.com 2026-05-26 CNA
Business 'Lazy' narrative to connect AI to job cuts, says Nvidia boss Jensen Huang "If you don't engage the technology of your time, you'll just simply be left behind," Mr Huang told CNA's Victoria Jen in a wide-ranging interview. Nvidia CEO Jensen Huang prior to a state dinner with President Donald Trump and Chinese President Xi Jinping at the Great Hall of the People on May 14, 2026, in Beiji
2026-05-26
www.digitimes.com 2026-05-26 digitimes
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level,... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-05-26
www.digitimes.com 2026-05-26 digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activa
2026-05-26
www.digitimes.com 2026-05-26 digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activa
2026-05-26
news.google.com 2026-05-26 simplywall.st
__fail__
2026-05-26
www.tradingview.com 2026-05-26 TradingView
__fail__
2026-05-26
drrobertcastellano.substack.com 2026-05-26 Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
TSMC’s AI Dominance Is Creating New Opportunities for China’s Foundries DR. ROBERT CASTELLANO MAY 26, 2026 ∙ PAID 9 Share What’s in This Article Introduction Why AI Is Expanding Beyond Advanced GPUs Table 1: Foundry Revenue Mix by Technology Segment (Estimated 2025) How TSMC’s AI Focus Is Reshaping Mature Nodes Chart 1: TSMC Advanced Technology Roadmap How TSMC’s Own Roadmap Is Changing the Semico
2026-05-26
www.prnewswire.com 2026-05-26 PR Newswire
AIC to Showcase Next-Generation AI Infrastructure and Host Strategic Panel with NVIDIA and VAST Data at COMPUTEX 2026 Deutschland - English VOM NACHRICHTENDIENST AIC 26 Mai, 2026, 02:18 GMT ARTIKEL TEILEN TAIPEI, May 26, 2026 /PRNewswire/ -- AIC, a leading provider of AI storage and computing solutions, is proud to announce its participation in COMPUTEX 2026. From June 2 to June 5, AIC
2026-05-26
www.asiae.co.kr 2026-05-26 아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package Over 30% Reduction in Thermal Resistance Proven MR-MUF Process Applied Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue. On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
www.asiae.co.kr 2026-05-26 아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package Over 30% Reduction in Thermal Resistance Proven MR-MUF Process Applied Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue. On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
stocktwits.com 2026-05-26 Stocktwits
__fail__
2026-05-26
simplywall.st 2026-05-26 simplywall.st
__fail__
2026-05-26
simplywall.st 2026-05-26 simplywall.st
__fail__
2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
__fail__
2026-05-26
digitimes.com 2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com 2026-05-26
Huawei has released itsData Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era.
2026-05-26
digitimes.com 2026-05-26
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has decreased rather than increased, with some employees threatening to follow Samsung Electronics' union with a strike to fight for their rights.
2026-05-26
digitimes.com 2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com 2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.