Semiconductor News & Analysis Feed
1044 articles
2026-05-28
bioengineer.org
2026-05-28
Bioengineer.org
In the face of a rapidly evolving electronic landscape, the challenge of electromagnetic interference and pollution has surged to the forefront of scientific research and technological innovation. High-intensity, multi-frequency electromagnetic radiation poses pervasive risks that extend beyond the mere disruption of electronic devices, threatening information security and biological health across
2026-05-28
www.eurekalert.org
2026-05-28
EurekAlert!
__fail__
2026-05-28
www.asiaresearchnews.com
2026-05-28
Asia Research News |
□ Professor Hyuk-Jun Kwon's research team at the Department of Electrical Engineering and Computer Science, DGIST (President Kunwoo Lee), has developed a new optical doping technology that precisely controls the electrical properties of two-dimensional (2D) semiconductors using light. This research is expected to contribute to the development of next-generation ultra-compact and high-density semic
2026-05-28
news.google.com
2026-05-28
Business Wire
2026-05-28
news.google.com
2026-05-28
Stock Titan
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
__fail__
2026-05-28
www.stocktitan.net
2026-05-28
Stock Titan
__fail__
2026-05-28
www.tradingview.com
2026-05-28
TradingView
__fail__
2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
Share this article
0
Join the conversatio
2026-05-28
www.marketbeat.com
2026-05-28
MarketBeat
__fail__
2026-05-28
www.prnewswire.com
2026-05-28
PR Newswire
Cenfire Announces Silicon-Based CF2140 MEMS Switch Platform for Semiconductor Test and Measurement Applications
NEWS PROVIDED BY
Cenfire
May 28, 2026, 06:00 ET
SHARE THIS ARTICLE
SANTA BARBARA, Calif., May 28, 2026 /PRNewswire/ -- Cenfire today announced sampling availability of its CF2140 MEMS switch platform, a 4-channel SPST switching solution designed to help semiconductor test organ
2026-05-28
www.marketbeat.com
2026-05-28
MarketBeat
__fail__
2026-05-28
www.mymalonetelegram.com
2026-05-28
The Malone Telegram
Future Electronics Features Infineon CoolGaN™ Transistors & GaN-Based Solutions for Humanoid Robotics
59 mins ago
Facebook
Twitter
Email
Facebook
Twitter
Email
Print
Copy article link
Save
Future Electronics, a global leader in electronic components distribution, is highlighting Infineon Technologies AG CoolGaN™ transistors and GaN-based solutions engineered to support the growing demands of huma
2026-05-28
cryptobriefing.com
2026-05-28
Crypto Briefing
__fail__
2026-05-28
digitimes.com
2026-05-28
UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu
2026-05-28
digitimes.com
2026-05-28
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr
2026-05-28
digitimes.com
2026-05-28
Passive component manufacturer Yageo held its 2026 annual shareholders meeting on May 27. In a post-meeting interview, chairman Pierre Chen confirmed that the world's two largest multilayer ceramic capacitor (MLCC) makers, Japan's Murata Manufacturing and South Korea's Samsung Electro-Mechanics (Semco), have recently issued price increase notices to customers and distributors.
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
www.ad-hoc-news.de
2026-05-28
AD HOC NEWS
Infineon’s, PCIM
Infineon’s PCIM Showcase Puts the Fuel Behind Its 100% Rally Under the Microscope
27.05.2026 - 22:10:56 | boerse-global.de
Infineon showcases SiC, GaN, and AI data center solutions at PCIM Europe amid a 106% stock surge, signaling a strategic pivot from component maker to complete energy infrastructure partner.
Infineon’s PCIM Showcase Puts the Fuel Behind Its 100% Rally Under t
2026-05-28
247wallst.com
2026-05-28
24/7 Wall St.
__fail__