Semiconductor News & Analysis Feed

On July 30, 2026, Union Semiconductor (USC) held a signing ceremony for its HITS advanced packaging R&D and industrialization project in Jiading District, Shanghai, marking the official landing of the initiative. With a total investment of no less than 7.5 billion yuan, the project aims to build an

MKS Inc. (NASDAQ:MKSI), a key supplier in next-generation semiconductor manufacturing, was highlighted by Spyglass Capital Management LLC’s Q2 2026 investment strategy as a notable holding. The Spyglass Growth Strategy outperformed major benchmarks, delivering a 24.63% return in Q2, driven by strong

In late July 2026, Cadence Design Systems reported Q2 2026 results with revenue of $1,584.45 million and GAAP net income of $367.08 million, while raising full-year 2026 guidance for both revenue and earnings. The company also completed a $5.21 billion share repurchase covering 13.52% of its shares

The global advanced packaging underfill materials market is experiencing robust growth driven by the increasing adoption of AI, high-performance computing, high-bandwidth memory, and chiplet architectures. These trends are pushing packaging toward larger bodies, multi-die integration, and finer inte

On July 31, 2026, MarketBeat reported that TrueWealth Financial Partners acquired 1,938 shares of Taiwan Semiconductor Manufacturing Company (TSMC), valued at approximately $655,000, during the first quarter, increasing institutional ownership to 16.51%. TSMC continues to receive strong market suppo

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly developing an advanced packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB), according to The Information, which cited two sources familiar with the project. The collaboration involves substrate maker Ki