Semiconductor News & Analysis Feed
2234 articles
2026-05-29
www.barrons.com
2026-05-29
Barron's
__fail__
2026-05-29
www.cnx-software.com
2026-05-29
CNX Software
POSTED ON
MAY 29, 2026 BY JEAN-LUC AUFRANC (CNXSOFT) - NO COMMENTS
ON PETROS CH32H417M ALEF – A RASPBERRY PI PICO-SIZED RISC-V USB 3.0 CAMERA BOARD
Petros CH32H417M Alef – A Raspberry Pi Pico-sized RISC-V USB 3.0 camera board
XPU Labs’ Petros CH32H417M Alef is a Raspberry Pi Pico-sized board based on the WCH CH32H417W RISC-V USB 3.0 microcontroller and taking a 2MP OV2640 camera module through th
2026-05-29
www.tradingview.com
2026-05-29
TradingView
__fail__
2026-05-29
news.google.com
2026-05-29
KED Global
2026-05-29
koreajoongangdaily.joins.com
2026-05-29
Korea JoongAng Daily
To write comments, please log in to one of the accounts.
등록
2026-05-29
www.koreaherald.com
2026-05-29
The Korea Herald
New tie-up fuels hopes for Samsung's foundry orders
(AP-Yonhap)
Samsung Electronics and SK hynix have taken strategic stakes in Anthropic, the developer of the Claude artificial intelligence models, joining a funding round that valued the US startup at $965 billion, making it the world's most valuable AI company ahead of OpenAI.
The deal is also fueling expectations that Samsung could win futur
2026-05-29
www.chosun.com
2026-05-29
조선일보
By Yoo Jane
Published 2026.05.29. 14:15
Updated 2026.05.29. 14:27
On the 28th afternoon, indices display on an electronic board at Hana Bank's dealing room in Jung-gu, Seoul. /Newsis
The market capitalization gap between South Korea’s leading semiconductor stocks, Samsung Electronics and SK Hynix, is rapidly narrowing. Amid expectations of expanding demand for artificial intelligence (AI) semico
2026-05-29
www.moomoo.com
2026-05-29
Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here.
Investment products and services are offered through Moomoo Financial Inc., Member SIPC./FINRA.
For further inform
2026-05-29
www.neowin.net
2026-05-29
Neowin
www.neowin.net
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a033f9a94cc005bc
Performance and Security by Cloudflare
Privacy
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
__fail__
2026-05-29
kfgo.com
2026-05-29
KFGO
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
www.msn.com
2026-05-29
MSN
__fail__
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89 billion (approx. US$665.7 million) in 2025, up 13% from NT$18.496 billion in 2024. Consolidated revenue reached NT$24.989 billion, increasing 8% from NT$23.187 billion in 2024. Earnings per share (EPS) came in at NT
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
__fail__