Semiconductor News & Analysis Feed
20 articles
2026-08-06
2026-07-31
simplywall.st
2026-07-31
The recent rebound in South Korean chip stocks following market pressure has once again brought global semiconductor stocks into the spotlight. With the Kospi index rising, major players like Samsung Electronics and SK Hynix have responded strongly to renewed optimism around AI spending, prompting i
2026-07-31
2026-07-30
tspasemiconductor.substack.com
2026-07-30
2026-07-24
www.eenewseurope.com
2026-07-24
NVIDIA has entered into a strategic partnership with Amkor, a leading semiconductor packaging and testing company, to expand advanced packaging capacity in the United States, supporting next-generation AI infrastructure. The $1.5 billion prepayment agreement underscores the growing strategic importa
2026-07-24
2026-07-24
news.google.com
2026-07-24
2026-07-18
2026-07-16
finance.yahoo.com
2026-07-16
2026-07-15
finance.biggo.com
2026-07-15
2026-07-14
news.google.com
2026-07-14
2026-07-10
2026-07-10
2026-07-09
www.theglobeandmail.com
2026-07-09
ASE Technology Holding ASX is benefiting from the growing demand for AI chip packaging. In the first quarter of 2026, ASX's Assembly, Testing and Materials (ATM) business performed better than expected despite fewer working days and did not experience the usual seasonal slowdown. Management said AI-
2026-07-09
www.tradingview.com
2026-07-09
As artificial intelligence (AI) technology continues to advance rapidly, demand for high-performance chip packaging is rising, presenting new growth opportunities for global semiconductor packaging companies. ASE Technology Holding ASX, a leading provider of semiconductor packaging and testing servi
2026-07-09
www.tradingview.com
2026-07-09
Amtech Systems Inc. (ASYS) is gaining significant traction from the surging demand for AI packaging, positioning itself as a key player in the semiconductor supply chain. As AI chip manufacturing and data center infrastructure expand globally, demand for advanced packaging equipment is rising. In Q2
2026-06-30
news.google.com
2026-06-30
2026-06-30
biz.chosun.com
2026-06-30
Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40 equipment on June 30, 2026, aimed at supporting advanced packaging processes for AI system semiconductors. Designed specifically for the CoWoS (Chip on Wafer on Substrate) process, the device can handle dies ranging from 3x3 mm to
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is targeting the AI packaging market following its dominance in HBM technology. As AI computing demands surge, the semiconductor industry is experiencing increased demand for high-performance memory and advanced packaging solutions. HBM technology, currently a core component in d
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is aggressively targeting the AI packaging market following its dominance in HBM (High Bandwidth Memory). This strategic move reflects the semiconductor industry's shift from traditional chip manufacturing to high-value packaging technologies, driven by surging AI computing deman