JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts

JCET's increased 2026 capex to RMB 10 billion signals a surge in demand for AI chip packaging, reshaping global supply chains. This trend intensifies bottlenecks in advanced packaging technologies, particularly in WLP and SiP, compelling upstream equipment and materials suppliers to ramp production. From a compliance standpoint, geopolitical risks in Taiwan and Hong Kong, China, may raise operational costs, especially regarding technology transfers and equipment imports. Competitors like SMIC and Powerchip may accelerate backend process investments to gain market share. Over the next 12–24 months, sustained AI-driven packaging demand will fuel a prolonged high-capital, high-tech cycle, forcing global supply chain realignment.