Semiconductor News & Analysis Feed

For half a century, progress in computing has been told as a story about processors. Yet the workloads now defining the industry — the large generative models behind modern AI — have quietly rewritten the rules. Their performance is no longer governed by how fast a chip can calculate. It is governed by how quickly, and how affordably, data can be delivered to the calculation.

Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted