Semiconductor News & Analysis Feed

91 articles
2026-05-30
simplywall.st 2026-05-30 simplywall.st
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2026-05-30
www.thenews.com.pk 2026-05-30 The News International
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2026-05-30
digitimes.com 2026-05-30
Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM and NAND supply.
2026-05-29
www.engineering.com 2026-05-29 Engineering.com
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2026-05-29
pluang.com 2026-05-29 Pluang
Isabelle Hudon’s CEO mandate at BDC renewed through 2030 to support Canadian entrepreneurs amid uncertainty Isabelle Hudon's term as CEO of the Business Development Bank of Canada (BDC) has been extended until 2030. Since her appointment in 2021, Hudon has expanded BDC's client base by nearly 50% and launched key initiatives supporting Canadian SMEs, inclu... Company Fundamentals Bullish · 20 mi
2026-05-29
pluang.com 2026-05-29 Pluang
Semiconductor demand soars as AI drives record growth, says Applied Materials CEO Applied Materials CEO Gary Dickerson stated the semiconductor industry is experiencing its strongest period ever, fueled by unprecedented demand from artificial intelligence (AI). The company, a key supplier of semiconductor manufacturing equipment, ... Market News Bullish · 12 hours ago
2026-05-29
www.stocktitan.net 2026-05-29 Stock Titan
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2026-05-29
digitimes.com 2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-28
tomshardware.com 2026-05-28 Jowi Morales
Law enforcement agencies are warning that protests over AI and data centers could boil over and turn into civil unrest.
2026-05-28
www.eenewseurope.com 2026-05-28 eeNews Europe
Toshiba has started test-sample shipments of a 1200V trench-gate SiC MOSFET aimed at power supply systems in AI data centres. The TW007D120E is housed in a QDPAK top-side cooled package and is designed to support higher current capability, improved thermal performance and higher power density in the power stage.
2026-05-28
digitimes.com 2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
digitimes.com 2026-05-28
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board
2026-05-28
digitimes.com 2026-05-28
On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure, particularly in high-speed interconnect, Ethernet switching, and custom silicon solutions used in hyperscale cloud deployments.
2026-05-28
pulse2.com 2026-05-28 Pulse 2.0
Qualcomm and HUMAIN announced a memorandum of understanding to collaborate on next-generation AI data centers, cloud-to-edge infrastructure, and hybrid AI services in Saudi Arabia and global markets. The agreement was signed during the Saudi-US Investment Forum in Riyadh during the visit of U.S. President Donald Trump to Saudi Arabia. Under the agreement, Qualcomm Technologies and HUMAIN plan to
2026-05-28
www.networkworld.com 2026-05-28 Network World
SK Hynix claims a 30% reduction in thermal resistance for its new chip design integrating cooling inside HBM memory stacks. SK Hynix has plans to make high-bandwidth memory run cooler than these old chips. Credit: Gordon Mah Ung South Korean semiconductor giant SK Hynix has announced a new type of high-bandwidth memory (HBM) for AI datacenters that improves heat dissipation by integrating a cool
2026-05-27
tomshardware.com 2026-05-27 Jowi Morales
Are we going to see another Hollywood movie in the future?
2026-05-27
www.eletimes.ai 2026-05-27 ELE Times
Search ELE Times Search HomeElectronicsInfineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and... Electronics Semiconductors and Chips News World News Infineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and Electromobility at PCIM Europe 2026 ELE Times News May 27, 2026 PCIM 2026 At PCIM Europe 2026 in Nuremberg
2026-05-27
finance.yahoo.com 2026-05-27 Yahoo Finance
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2026-05-27
digitimes.com 2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-27
simplywall.st 2026-05-27 simplywall.st
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