Semiconductor News & Analysis Feed

Apple's planned M7 Ultra chip is being designed to support up to 1.5 TB of unified memory and to push AI performance toward the class of Nvidia's Blackwell accelerators.

Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i

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SK hynix unveils ‘iHBM’ thermal solution to boost AI performance MAY 26, 2026|BY LIUTENG Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility SEOUL

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SK hynix unveils 'iHBM' thermal solution to boost AI performance NEWS PROVIDED BY SK hynix Inc. May 25, 2026, 19:39 ET SHARE THIS ARTICLE Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments Lowers barriers to adoption by leveraging market-proven MR–

SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-

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