Semiconductor News & Analysis Feed

7 articles
2026-07-10
finance.yahoo.com 2026-07-10 Yahoo Finance
Micron raises U.S. investment to $250 billion for AI memory chips Micron raises U.S. investment to $250 billion for AI memory chips · Quartz · SOPA Images / Getty images Colleen Cabili July 10, 2026 2 min read MU +12.17% Trade MU on Coinbase Trading disclosure Micron Technology announced Thursday it is raising its planned U.S. investment to more than $250 billion through 2035, a roughly $50 billi
2026-07-10
qz.com 2026-07-10 qz.com
Micron $MU Technology announced Thursday it is raising its planned U.S. investment to more than $250 billion through 2035, a roughly $50 billion increase from its prior commitment, driven by demand for memory chips in the artificial intelligence era. Reaching 40% of DRAM output on U.S. soil is the target the expanded funding is designed to hit, and Micron projected that the broader domestic manuf
2026-06-22
eciks.org 2026-06-22 eciks.org
Micron stock hits record as AI memory demand accelerates Published on 22 June 2026 at 10:56 am • Written by Chris Martin • Reading duration : 2 minutes · read 163 times © Micron stock hits record as AI memory demand accelerates Share this post Micron Technology stock hit an all-time closing high of $1,133.99 on June 18, 2026, as artificial intelligence memory demand continues to accelerate far
2026-06-18
seekingalpha.com 2026-06-18 Seeking Alpha
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2026-06-09
cryptobriefing.com 2026-06-09 Crypto Briefing
Nvidia and SK Hynix sign multi-year pact to develop next-gen AI memory chips The partnership targets HBM4 memory for Nvidia's Vera Rubin platform, with initial deliveries planned for Q3 2026.
2026-05-26
vir.com.vn 2026-05-26 Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-08
www.benzinga.com 2026-05-08 Benzinga
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