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Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now expected in the first or second quarter of 2027. The overhaul is aimed at meeting listing requirements on corporate governance, independence, and the rule that senior executives cannot hold concurrent cross-company roles

Samsung brings HBM, logic, and optics together in packaging push

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digitimes.com 2026-07-14

Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.

AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples

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digitimes.com 2026-07-14

All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an industry-wide upcycle rather than gains concentrated in a single segment.

Intel concentrates its European chipmaking in Ireland with EUR5 billion Leixlip expansion

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digitimes.com 2026-07-14

Intel is doubling down on Ireland as the anchor of its European manufacturing base, committing EUR5 billion (US$5.7 billion) to expand its Leixlip campus barely a year after scrapping far larger fab projects in Germany and Poland. The move signals that, under a turnaround intended to align capacity with real demand, the chipmaker sees consolidated, upgraded capacity in a proven site — rather than

Gudeng Precision Industrial posts record second quarter revenue on advanced semiconductor carrier demand

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digitimes.com 2026-07-14

Gudeng Precision Industrial Electronics reported record June revenue and its highest quarterly sales in the second quarter of 2026, driven by stronger demand for EUV mask carriers and 12-inch wafer carriers as advanced-node manufacturing accelerated. The Taiwan-based supplier said momentum should remain strong in the second half of 2026, keeping full-year results on pace to challenge another high.

Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

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digitimes.com 2026-07-14

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou

Taiwan AI suppliers ride global demand as substrate, and CCL markets tighten

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digitimes.com 2026-07-14

Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing. The latest sales data suggest the upgrade cycle is broadening beyond one segment, with advanced ABF substrates and high-end CCL benefiting from higher specifications, better pricing, and rising AI content. For inves

GigaDevice director maps memory's next three years: capacity, AI demand, and the race for new applications

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digitimes.com 2026-07-14

AI computing demand continues to fuel growth in the global memory market, but the industry's attention is shifting beyond short-term price movements. Increasingly, the focus is on longer-term variables, including the pace of capacity expansion, the sustainability of AI-driven demand, and whether emerging AI applications can achieve commercial scale.

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