Semiconductor News & Analysis Feed
10791 articles
2026-06-16
aijourn.com
2026-06-16
The AI Journal
Advanced Conversion selects Peak Nano’s NanoPlex™ LDF film for its DC-link capacitors, eliminating the thermal and derating compromises that have constrained Silicon Carbide inverter system designs.
VALLEY VIEW, Ohio, June 16, 2026 /PRNewswire/ — Advanced Conversion, a wholly owned subsidiary of Electro Technik Industries (ETI) of Clearwater, Florida, has selected Peak Nano’s NanoPlex™ LDF film a
2026-06-16
news.google.com
2026-06-16
Stock Titan
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
www.thefpsreview.com
2026-06-16
The FPS Review
NVIDIA/Intel Partnership Could See an x86 Processor Paired with RTX Graphics Released by 2028
NEWS
TECH
By
Peter Brosdahl
June 16, 2026
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Image: NVIDIA
A new rumor states that NVIDIA and Intel could be working together to develop a new type of x86 CPU with integrated RTX graphics. At on
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Resonac, JP3521500008
New SiC power module push, Resonac Hipo™ MOSFET aims at next-gen EV inverters
16.06.2026 - 13:43:03 | ad-hoc-news.de
Resonac is expanding its silicon carbide portfolio with the Hipo SiC MOSFET module line, targeting high-efficiency inverters for electric vehicles and industrial drives. The modules focus on low loss, high reliability and support for 800-volt architectures in
2026-06-16
www.msn.com
2026-06-16
MSN
Nvidia (NVDA) provided additional details on its bond offering, telling investors it intends to raise $25B.
The company, which made the disclosure in a filing with the Securities and Exchange Commission, will offer the debt in seven tranches, with maturities ranging from 2028 to 2056. The yields range from 4.25% for the 2028 note to 5.625% for the 2056 note. The tranches are between $3.5B and $4B
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
www.globsec.org
2026-06-16
GLOBSEC
www.globsec.org
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2026-06-16
www.theglobeandmail.com
2026-06-16
The Globe and Mail
Oppenheimer analyst Rick Schafer maintained a Buy rating on Nvidia on June 12 and set a price target of $265.00. The company’s shares closed last Friday at $205.19.
Schafer covers the Technology sector, focusing on stocks such as Marvell, Nvidia, and Semtech. According to TipRanks, Schafer has an average return of 34.3% and a 73.80% success rate on recommended stocks.
Currently, the analyst cons
2026-06-16
www.theregister.com
2026-06-16
The Register
SYSTEMS
Qualcomm said to be circling AI chip biz Tenstorrent in $10B RISC-V power play
Potential takeover would represent significant commitment to the open instruction set architecture
Dan Robinson
1
Published Tue 16 Jun 2026 // 11:15 UTC
Qualcomm is reportedly moving to buy AI chip firm Tenstorrent, an acquisition that could prove a major boost to the RISC-V ecosystem.
This comes from The I
2026-06-16
wccftech.com
2026-06-16
Wccftech
The memory requirements of experiencing the entire Siri AI features suite will eventually force Apple to introduce a minimum of 12GB LPDDR5X RAM for its iPhone 18 lineup, but more importantly, is how increased demand for these devices will contribute to the existing memory crisis while making a handful of suppliers wealthy in the process.
2026-06-16
tomshardware.com
2026-06-16
Jowi Morales
Will Finland be successful in convicting a crew suspected of damaging its undersea infrastructure this time?
2026-06-16
www.axios.com
2026-06-16
Axios
www.axios.com
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2026-06-16
news.google.com
2026-06-16
CNBC
2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
INFRASTRUCTURE
tsmc
chip packaging
cowos
copos
TSMC highlights CoWoS strength over panel packaging for largest AI chips
1 sources
|
June 16, 2026
6.8
Relevance Score
Photo: cdn.mos.cms.futurecdn.net · rights & takedowns
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At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
www.tomshardware.com
2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
News
By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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2026-06-16
www.communicationstoday.co.in
2026-06-16
Communications Today
www.communicationstoday.co.in
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2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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