Semiconductor News & Analysis Feed
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2026-05-28
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2026-05-28
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2026-05-28
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2026-05-28
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2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-28
evertiq.com
2026-05-28
Evertiq
© Amkor
Business | May 28, 2026
Amkor acquires additional land in Arizona to expand advanced packaging campus
Evertiq
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.
The acquisition adds to Amkor's existing 104-
2026-05-28
www.grandviewresearch.com
2026-05-28
Grand View Research
www.grandviewresearch.com
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2026-05-28
digitimes.com
2026-05-28
UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-27
natlawreview.com
2026-05-27
The National Law Review
Vadzo Imaging Launches Color USB 3.2 Gen1 UVC Camera with Onsemi AR0235 HyperLux™ SG Global Shutter Sensor
Vadzo Imaging Launches Color USB 3.2 Gen1 UVC Camera with Onsemi AR0235 HyperLux™ SG Global Shutter Sensor
Press Release Date 05-27-2026
Vadzo Imaging Launches Falcon-235CGS
AR0235 HyperLux™ SG | Global Shutter | Upto 120 fps | Onboard ISP | Dynamic ROI | ROI-Based Auto Exposure |
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
www.indexbox.io
2026-05-27
IndexBox
Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t
2026-05-27
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2026-05-27
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<Research> Citi: "Tao's Law" Signals Shift Toward Chip/Circuit/System Design Innovation; Advanced Packaging Players Such as ASMPT (00522.HK) Expected to Benefit
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2026-05-27
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2026-05-27
www.theworldfolio.com
2026-05-27
The Worldfolio
As global supply chains are reshaped by geopolitical tensions and manufacturing shifts, Sanritsu Corporation is enhancing precision logistics through advanced packaging technologies, ensuring the safe transport of high-value components that underpin critical industries worldwide.
To begin, we would like to discuss the broader global and macroeconomic environment. In recent years, geopolitical ten
2026-05-27
www.eqs-news.com
2026-05-27
EQS News
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
ARTIKEL TEILEN
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
www.thailand-business-news.com
2026-05-27
Thailand Business News
www.thailand-business-news.com
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2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.