Semiconductor News & Analysis Feed
621 articles
2026-06-10
www.astutegroup.com
2026-06-10
Astute Group
www.astutegroup.com
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2026-06-10
www.trendforce.com
2026-06-10
TrendForce
[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June Amid Capacity Expansion
2026-06-10 Semiconductors editor
News
Please note that this article cites information from Hankyung, New Daily, Reuters, and The Dong-A Ilbo.
Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plan
2026-06-10
www.thelec.net
2026-06-10
thelec.net
(Source: Imagis Technology)
Imagis Technology secured a vehicle semiconductor supply contract worth about KRW 5.8 billion, equivalent to roughly 44% of the company's annual revenue last year, according to a regulatory filing disclosed on June 8.
The contract marks the first major achievement under newly appointed CEO Lee Dong-seop, who took office in March this year.
The customer was identified
2026-06-10
digitimes.com
2026-06-10
Global hardware growth is facing an increasingly fragile and fragmented supply chain. At PCIM Europe 2026, software intelligence firm Luminovo's OEM Growth Lead, Inga Schwarz, made a compelling case for why AI is no longer enough to save hardware companies from costly operational challenges. The industry, she argued, must embrace a transition toward deep, native domain enterprise integration to bu
2026-06-10
digitimes.com
2026-06-10
The Taiwanese government has launched an AI infrastructure initiative aiming to further strengthen its semiconductor industry prowess by leveraging silicon photonics (SiPh) to form a new moat, as AI-driven demand for high-speed data transfer accelerates.
2026-06-10
digitimes.com
2026-06-10
Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management. The shift signals firmer supply-chain conditions, rising leadframe demand, and broader pressure on packaging capacity across Asia — factors with direct implications for global electronics buyers and investors.
2026-06-10
digitimes.com
2026-06-10
Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that would expand its backend chipmaking footprint as demand for high-bandwidth memory and AI-related chips grows.
2026-06-10
www.indexbox.io
2026-06-10
IndexBox
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2026-06-09
www.bnnbloomberg.ca
2026-06-09
BNN Bloomberg
SEOUL, June 9 (Reuters) - Samsung Electronics is considering the construction of an advanced semiconductor packaging facility in the southwestern South Korean city of Gwangju, the Korea Economic Daily said on Tuesday.
Here are some details:
Samsung is expected to unveil the investment plan at a meeting between South Korean President Lee Jae Myung and the heads of the country’s largest conglomera
2026-06-09
english.cw.com.tw
2026-06-09
天下雜誌
english.cw.com.tw
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2026-06-09
www.prnewswire.com
2026-06-09
PR Newswire
Sony Semiconductor Solutions to Release X-ray CMOS Sensor with Industry's Fastest(*1) Imaging and Low-Noise Performance for Inspection and Measurement Instrumentation
NEWS PROVIDED BY
Sony Electronics, Inc.
Jun 08, 2026, 22:00 ET
SHARE THIS ARTICLE
High-accuracy energy measurements and photon-level data acquisition on a single chip
ATSUGI, Japan, June 8, 2026 /PRNewswire/ -- Sony Semico
2026-06-09
technode.global
2026-06-09
TNGlobal
Silicon Box, a Singapore-based advanced semiconductor panel-level packaging and chiplet integration firm, has on Monday announced that it has secured S$100 million ($77.65 million) in debt financing from leading institutional investors – funds managed by Ares Management Corporation (Ares), InnoVen Capital, January Capital Growth Credit (January Capital), and Abound Capital.
The facility includes
2026-06-09
digitimes.com
2026-06-09
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
2026-06-09
digitimes.com
2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-06-09
digitimes.com
2026-06-09
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026. Its earlier investment in US silicon photonics firm Skorpios and the acquisition of Pingood Enterprise also form part of the group's co-packaged optics (CPO) strategy.
2026-06-09
www.streetinsider.com
2026-06-09
StreetInsider
www.streetinsider.com
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2026-06-09
www.01net.it
2026-06-09
01net
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2026-06-09
za.investing.com
2026-06-09
Investing.com South Africa
za.investing.com
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2026-06-09
www.investing.com
2026-06-09
Investing.com
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2026-06-09
www.marketscreener.com
2026-06-09
marketscreener.com
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