Samsung Electronics considers building chip packaging plant, Economic Daily says - BNN Bloomberg

According to the Korean Economic Daily, Samsung Electronics is considering building an advanced semiconductor packaging facility in Gwangju, a city in South Korea's southwest. The investment plan is e... Read original →

Samsung’s potential advanced packaging plant in Gwangju signals a strategic pivot to reclaim control over the AI chip stack’s foundational layer. With HBM demand surging, reliance on TSMC’s CoWoS packaging has become a critical vulnerability. This move pressures SK Hynix to deepen co-development with AMD and Intel while offering U.S. hyperscalers an alternative to Taiwan-centric packaging. However, without concurrent breakthroughs in 3nm DRAM yield and EUV scaling, Samsung risks building packaging capacity around constrained memory dies. Over the next 18 months, the battle for HBM4 standard leadership will shift from pure density to integrated packaging-memory co-design—turning packaging from a back-end afterthought into a core competitive moat.