Semiconductor News & Analysis Feed
621 articles
2026-06-13
digitimes.com
2026-06-13
Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit satellite communications customer and first equipment deliveries completed in the first half of 2026. The company said related sales could quickly rise to double digits as a share of annual revenue, with implications for supply chains worldwide.
2026-06-12
www.quiverquant.com
2026-06-12
Quiver Quantitative
Amkor Technology, Inc. (AMKR) is up 7.6% today. Here is some analysis on what might have caused this price movement.
Analysis: The day’s specific catalyst is not clearly identifiable from widely circulated company news, but the move appears consistent with renewed optimism around Amkor’s advanced packaging roadmap and multi-year growth targets discussed recently. This could also be momentum tied
2026-06-12
mezha.ua
2026-06-12
Mezha
mezha.ua
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2026-06-12
www.digitimes.com
2026-06-12
digitimes
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
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2026-06-12
news.futunn.com
2026-06-12
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2026-06-12
www.electronicsforyou.biz
2026-06-12
Electronics For You BUSINESS
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2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued momentum in global semiconductor supply chains, with implications for networking, memory, and high-performance computing markets worldwide.
2026-06-12
digitimes.com
2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-11
news.futunn.com
2026-06-11
富途牛牛
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2026-06-11
digitimes.com
2026-06-11
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating c
2026-06-11
digitimes.com
2026-06-11
Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.
2026-06-11
digitimes.com
2026-06-11
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials engineering. The shift matters far beyond one company, because AI demand is increasing worldwide and is expected to influence data centers, device costs, energy use, and the pace of technology development.
2026-06-11
www.newelectronics.co.uk
2026-06-11
New Electronics
www.newelectronics.co.uk
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2026-06-11
news.alphastreet.com
2026-06-11
AlphaStreet
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TSMC (TSM) Has a Foundry-and-Packaging Moat Bigger Than the AI Trade
ANALYSIS
TSMC (TSM) Has a Foundry-and-Packaging Moat Bigger Than the AI Trade
NYSE
$TSM
June 10, 2026
5 min read
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in
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Introduction
Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) is often discussed as the cleanest public-market way to play artificial intelligence chip demand. That framing is not wrong, but
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
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2026-06-10
en.clickpetroleoegas.com.br
2026-06-10
CPG Click Petróleo e Gás
3 min of reading
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Samsung eyes strategic chip factory in South Korea and could shake up the global AI landscape with advancements in HBM memories and advanced packaging.
Written by
Caio Aviz
Published on
10/06/2026 at 08:11
Artificial Intelligence (AI)
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Possible investment in Gwangju could place Samsu
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
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智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-10
theedgemalaysia.com
2026-06-10
The Edge Malaysia
Economy Minister Akmal Nasrullah Mohd Nasir (Photo by Shahrill Basri/The Edge)
GEORGE TOWN (June 10): The Advanced Packaging Institute and Research Centre (APIRC) aims to develop 12 local small and medium enterprises (SMEs) in the advanced packaging ecosystem and attract new investments worth RM8.5 billion by 2030.
Economy Minister Akmal Nasrullah Mohd Nasir said the target would be implemented