Semiconductor News & Analysis Feed
621 articles
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
AI packaging push: how TSMC’s CoWoS advanced packaging is scaling for the next wave
15.06.2026 - 19:54:24 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging platform is at the center of the AI accelerator boom. Capacity for the 2.5D chip-on-wafer-on-substrate technology is ramping hard, with the foundry targeting well over 100,000 wafers per month as hyperscaler demand keeps clim
2026-06-15
simplywall.st
2026-06-15
simplywall.st
United States/Semiconductors/NasdaqGS:AMKR
Amkor Technology (AMKR) Is Up 21.2% After Outlining AI-Focused Advanced Packaging Expansion Strategy
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Share
Copy Link
Amkor Technology recently reported record Q1 2026 revenue and used its first Investor Day in nearly 20 years to outline ambitious long-term growth targets anchored in advanced packagi
2026-06-15
www.gurufocus.com
2026-06-15
GuruFocus
The owner of this website (www.gurufocus.com) has banned the autonomous system number (ASN) your IP address is in (45102) from accessing this website.
Please see https://developers.cloudflare.com/support/troubleshooting/http-status-codes/cloudflare-1xxx-errors/error-1005/ for more details.
Cloudflare Ray ID: a0c27d2148623b06 • Your IP: Click to reveal • Performance & security by Cloudflare
2026-06-15
news.futunn.com
2026-06-15
富途牛牛
__fail__
2026-06-15
www.sammobile.com
2026-06-15
SamMobile
SamMobile has affiliate and sponsored partnerships, we may earn a commission.
TSMC remains the undisputed leader in advanced contract chip manufacturing. Samsung has made some strides recently but the gap between the two is quite significant and unlikely to be closed any time soon.
However, there's one area where Samsung enjoys the advantage and the lead, and it appears that TSMC now wants to ta
2026-06-15
www.taiwannews.com.tw
2026-06-15
Taiwan News
www.taiwannews.com.tw
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0c0af4eea80596d
Performance and Security by Cloudflare
Privacy
2026-06-15
en.prnasia.com
2026-06-15
PR Newswire Asia
__fail__
2026-06-15
focusmalaysia.my
2026-06-15
Focus Malaysia
focusmalaysia.my
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0c042ba6d0ad674
Performance and Security by Cloudflare
Privacy
2026-06-15
www.businesstoday.com.my
2026-06-15
BusinessToday Malaysia
www.businesstoday.com.my
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0c0419dfc000837
Performance and Security by Cloudflare
Privacy
2026-06-15
www.digitimes.com
2026-06-15
digitimes
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-06-15
www.digitimes.com
2026-06-15
digitimes
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-15
www.thelec.net
2026-06-15
thelec.net
Samsung Electronics' Onyang NanoCity. (Photo: Samsung Electronics)
Samsung Electronics and SK hynix are in discussions to build their first semiconductor back-end packaging plants in Korea's Honam region, according to industry sources, with multiple candidate locations under consideration.
According to industry sources on June 14, Samsung Electronics is reviewing Gwangju and Saemangeum as potent
2026-06-15
www.digitaltrends.com
2026-06-15
Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors.
TSMC’s CoPoS packaging coul
2026-06-14
www.digitimes.com
2026-06-14
digitimes
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-06-14
digitimes.com
2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a