Semiconductor News & Analysis Feed

2 articles

2026-07-21

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV

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tomshardware.com 2026-07-21

Recent teardown analysis by SemiAnalysis of Huawei's Kirin 9030 chip revealed that SMIC's third-generation 7nm process (N+3) achieves a smaller metal pitch than Intel's 18A and surpasses TSMC's N6 in transistor density, despite not using EUV lithography. However, this does not make SMIC's N+3 proces

SMIC TSMC Intel Semiconductor Process 7nm Technology Metal Pitch Transistor Density EUV Lithography

2026-07-21

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing - Tom's Hardware

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