Semiconductor News & Analysis Feed

Kioxia, Sandisk begin to sample BiCS10 3D NAND: 332 active layers and over 29 Gb/mm2 areal capacity.

China's memory makers are moving from technology catch-up to capital-market expansion, with ChangXin Memory Technologies' (CXMT) parent and Yangtze Memory Technology (YMTC) both preparing initial public offerings (IPOs) to fund future capacity growth and technology upgrades. South Korean industry players are paying particularly close attention to YMTC, which focuses on NAND Flash and is closing in

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Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now