Semiconductor News & Analysis Feed
12 articles
2026-08-12
www.indexbox.io
2026-08-12
According to a market analysis report from indexbox.io, the global CMP (Chemical Mechanical Polishing) slurry market is projected to grow steadily through 2035, primarily driven by the rapid advancement of 3D NAND memory and advanced packaging technologies. CMP slurries are critical materials in sem
2026-08-10
news.google.com
2026-08-10
2026-08-10
2026-08-05
tomshardware.com
2026-08-05
Kioxia and Sandisk unveiled their latest BiCS10 3D QLC NAND flash chip at the Future of Memory and Storage Conference, showcasing the world's highest areal density at 37 Gb/mm². Designed for high-capacity data center SSDs, the device features 332 active layers and a 4,800 MT/s interface with SCA cap
2026-08-04
2026-07-12
www.indexbox.io
2026-07-12
2026-07-10
www.indexbox.io
2026-07-10
According to IndexBox's market analysis report, the semiconductor-grade disilane market is expected to experience sustained growth in the coming years, primarily driven by the rapid development of 3D NAND memory and extreme ultraviolet (EUV) logic technologies. Disilane, as a critical raw material i
2026-07-07
tomshardware.com
2026-07-07
Kioxia and Sandisk have announced the sampling of their latest 3D NAND flash memory, featuring a 332-layer stack with industry-leading areal density and performance. The 10th Generation BiCS 3D TLC NAND is tailored for high-density and performance-sensitive data center applications, surpassing Samsu
2026-06-17
www.communicationstoday.co.in
2026-06-17
As semiconductor industry competition intensifies, memory manufacturers are focusing on high-bandwidth memory (HBM) and advanced 3D NAND technologies to maintain competitive advantage. HBM technology significantly enhances memory bandwidth and performance through vertical chip stacking, particularly
2026-06-16
www.communicationstoday.co.in
2026-06-16
The semiconductor industry is experiencing unprecedented demand pressure driven by rapid artificial intelligence development. Recent market analysis reveals memory manufacturers are prioritizing high-bandwidth memory (HBM) and advanced 3D NAND storage technologies to meet the urgent demand for high-
2026-05-25
2026-05-14
www.digitimes.com
2026-05-14
According to reports, Samsung Electronics is reportedly reviving previously delayed semiconductor initiatives in next-generation NAND flash, compound semiconductors, advanced packaging, and substrates. This strategic shift indicates Samsung's renewed focus on comprehensive technology development aft