Semiconductor News & Analysis Feed
95 articles
2026-07-24
tomshardware.com
2026-07-24
Kunal Khullar
The latest update introduces more realistic CPU and GPU workloads, redesigned multi-core testing, AI-focused benchmarks, larger datasets, and CUDA support for Nvidia GPUs.
2026-07-22
tomshardware.com
2026-07-22
Bruno Ferreira
OpenAI's GPT-5.6 Sol and its gang escape from their cage and hack into HuggingFace's production servers — unprecedented incident raises eyebrows and pulses
2026-07-22
digitimes.com
2026-07-22
HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and testing project, joining BOE and other Chinese display makers in expanding upstream into semiconductors.
2026-07-20
news.google.com
2026-07-20
Stock Titan
2026-07-20
www.moomoo.com
2026-07-20
Moomoo
2026-07-20
digitimes.com
2026-07-20
Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia. Supply-chain sources said the company has relaunched its worldwide manufacturing sites, pushing ahead with Intel 18A mass production, 14A and high-NA EUV development, and advanced packaging programs including EMIB, EMIB-T, Foveros, and hybrid bonding (HB). The goal is
2026-07-17
digitimes.com
2026-07-17
The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June 2026 financial performances of key supply chain players in Taiwan. Within this thriving ecosystem, IC testing and design services have emerged as pivotal backbones ensuring the physical viability and operational efficiency of next-generation silicon.
2026-07-16
www.24-7pressrelease.com
2026-07-16
24-7 Press Release Newswire
2026-07-16
digitimes.com
2026-07-16
As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China. ASE, SPIL, KYEC, Greatek, and Tong Hsing are all pushing ahead in 2026 to strengthen supply-chain resilience amid geopolitical risk.
2026-07-15
digitimes.com
2026-07-15
China's JCET expects stronger first-half earnings as global demand tied to artificial intelligence (AI) infrastructure lifts semiconductor activity. The outlook signals continued momentum in chip packaging and testing, a sector closely watched by investors because it reflects broader technology spending trends that affect supply chains across Asia, the US, and Europe.
2026-07-15
digitimes.com
2026-07-15
Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace, but one that masks sharply divergent performance beneath the surface.
2026-07-15
news.google.com
2026-07-15
thestreet.com
2026-07-14
news.google.com
2026-07-14
Stock Titan
2026-07-14
digitimes.com
2026-07-14
China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx. US$110.62 million) to CNY850 million, up 231.16% to 275.31% from CNY226 million a year earlier, according to a forecast filed with the Shenzhen Stock Exchange. Diluted earnings per share are seen at CNY0.2290-0.25
2026-07-14
digitimes.com
2026-07-14
Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based chip validation and analysis provider said the result reflected stronger demand tied to AI chip validation and a spillover effect from capacity constraints at packaging and testing plants.
2026-07-13
tomshardware.com
2026-07-13
Kunal Khullar
Hidden settings suggest AMD is testing Multi Frame Generation.
2026-07-13
digitimes.com
2026-07-13
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing. The semiconductor testing company said the project would be its largest overseas expansion and was aimed at addressing a growing US gap in backend packaging and testing capacity.
2026-07-13
digitimes.com
2026-07-13
Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over year, marking a record high for four consecutive months. Second-quarter 2026 revenue reached NT$1.64 billion, a record high for a single quarter, while first-half 2026 revenue totaled NT$3.07 billion, an increase of 17.
2026-07-13
digitimes.com
2026-07-13
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including FormFactor, Advantest, Tokyo Electron (TEL), Teradyne, MPI, Keysight, Anritsu, ficonTEC, ADS Tech (ADST), All Ring Tech, GMT Global, Chroma ATE, Hon Precision, and WinWay Technology are rushing to secure a foothold in t
2026-07-12
digitimes.com
2026-07-12
Hermes Testing Solutions said that its June 2026 revenue jumped sharply as rising demand for advanced chip testing lifted sales of its custom products, cleaning materials, and engineering services. The test interface supplier said the growth was driven by continued strength in high-end semiconductor testing activity.