Semiconductor News & Analysis Feed

Generative AI applications are expanding rapidly, making computing costs a growing bottleneck to commercial AI deployment. The AI accelerator market, long dominated by graphics processing units (GPUs), has increasingly explored specialised architectures in recent years. Tensor Processing Units (TPUs), optimised for the matrix operations used by AI models, have again drawn industry attention.

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf

Broadcom has acknowledged it will not win all of Google's TPU orders, highlighting how tensor processing units have become a competitive arena for multiple chipmakers. For global readers, the shift signals a broader race for cloud AI supply, capacity, and influence, as more firms vie for a share of high-value custom chip demand.