Semiconductor News & Analysis Feed
1009 articles
2026-07-09
www.tradingview.com
2026-07-09
TradingView
2026-07-09
www.benzinga.com
2026-07-09
Benzinga
2026-07-09
www.benzinga.com
2026-07-09
Benzinga
2026-07-09
www.benzinga.com
2026-07-09
Benzinga
2026-07-09
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2026-07-09
The Globe and Mail
2026-07-09
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2026-07-09
Zacks Investment Research
2026-07-09
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2026-07-09
Zacks Investment Research
2026-07-09
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2026-07-09
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2026-07-09
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2026-07-09
Yahoo Finance
2026-07-09
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2026-07-09
Zacks Investment Research
2026-07-09
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2026-07-09
Yahoo Finance
2026-07-09
finance.yahoo.com
2026-07-09
Yahoo Finance
2026-07-09
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2026-07-09
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2026-07-09
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2026-07-09
TradingKey
2026-07-09
digitimes.com
2026-07-09
Micron Technology said July 9 it is raising its planned US fab and technology investment to more than $250 billion through 2035, citing surging demand for memory driven by AI. The company said the increase supports its long-term goal of producing 40% of its DRAM output domestically.
2026-07-09
digitimes.com
2026-07-09
Chinese companies are shifting more AI accelerator spending away from Nvidia and toward domestic suppliers, a sign that US-China technology tensions are no longer just reshaping chip exports, but the buildout of China's AI infrastructure itself.
2026-07-09
digitimes.com
2026-07-09
Micron Technology said July 9 it plans to invest up to $3 billion to strengthen the US semiconductor supply chain, with the bulk of the announcement centered on a new financing and supply arrangement with Taiwan's GlobalWafers.
2026-07-09
digitimes.com
2026-07-09
Arterytek, the microcontroller unit maker under Faraday Technology, said its unaudited June revenue rose to NT$370 million (US$11.53 million), up 20% from May and 114% from a year earlier. The company said second-quarter revenue reached NT$960 million, a record high, as customer demand recovered and key product shipments strengthened.
2026-07-09
digitimes.com
2026-07-09
Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early as 2026, potentially on the Taiwan Innovation Board. While Liu did not identify the company, industry observers believe the most likely candidate is Socle Technology Corp (Socle).
2026-07-09
digitimes.com
2026-07-09
Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as industry sources cited by ZDNetKoreasay the near-term case for the technology has weakened even though its long-term relevance remains intact.