Semiconductor News & Analysis Feed
291 articles
2026-05-27
digitimes.com
2026-05-27
Nvidia held an "employee town hall" on the morning of May 27 at the T17 and T18 sites in Beitou-Shilin Technology Park (BSTP), where CEO Jensen Huang met staff, gave away Dom Pérignon, and framed Taiwan as central to the company's AI expansion. Taipei Mayor Wayne Chiang attended only as a "guest."
2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-27
digitimes.com
2026-05-27
WinWay Technology's orders are already booked out five to six months in advance, says company Chairman Mark Wang. He expects new production capacity coming online at the company's Kaohsiung facilities to gradually ease supply shortages and help drive record monthly and quarterly revenue growth throughout the second half of 2026.
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
www.donga.com
2026-05-27
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
www.thelec.net
2026-05-27
thelec.net
SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix)
SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, emb
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.mk.co.kr
2026-05-27
매일경제
사진 확대
[Photo courtesy of Yonhap News]
SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages.
HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co
2026-05-27
www.benzinga.com
2026-05-27
Benzinga
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2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-27
www.12news.com
2026-05-27
12News
VALLEY
Amkor Technology to expand Peoria semiconductor campus, bring 3,000 new jobs
Amkor is expanding its future Peoria semiconductor campus from 104 to 171 acres as part of a $7 billion project expected to bring 3,000 jobs.
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2026-05-27
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2026-05-27
12News
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
Visit ROHM at booth 318 in hall 9
Demonstrating cutting edge power semiconductor technologies.
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Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
news.samsung.com
2026-05-27
samsung.com
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2026-05-27
www.taiwannews.com.tw
2026-05-27
Taiwan News
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2026-05-27
ca.finance.yahoo.com
2026-05-27
Yahoo! Finance Canada
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2026-05-27
www.fool.com
2026-05-27
The Motley Fool
Micron Technology (
MU
+16.00%
) supplies some of the world's best high-bandwidth memory (HBM) for data centers, which is critically important for processing artificial intelligence (AI) workloads. Demand for this hardware far exceeds supply, which is why Micron stock has exploded higher by 700% over the past year.
But another company is also benefiting from the blistering demand for memory. Axce
2026-05-26
247wallst.com
2026-05-26
24/7 Wall St.
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