Semiconductor News & Analysis Feed
70 articles
2026-07-04
digitimes.com
2026-07-04
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in a Super Cycle. According to ET News, the talks have intensified pressure across the supply chain as raw material costs stay high and substrate makers warn of margin erosion.
2026-07-04
www.digitimes.com
2026-07-04
digitimes
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in a Super Cycle. According to ET News, the talks have intensified...
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2026-07-02
digitimes.com
2026-07-02
China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and a 12-inch wafer fab reportedly slated to begin mass production in the second half of 2026. Industry analysts say China is extending display technologies built up with strong government backing into semiconductors as the US tightens restrictions, adding pressure on S
2026-06-30
digitimes.com
2026-06-30
Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for AI servers, while also expanding substrate production capacity and securing a separate silicon capacitor contract, according to Korean media reports and company statements.
2026-06-26
digitimes.com
2026-06-26
Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.
2026-06-25
www.openpr.com
2026-06-25
openPR.com
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2026-06-24
digitimes.com
2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.
2026-06-24
digitimes.com
2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-23
digitimes.com
2026-06-23
Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator, extending the companies' supply relationship from mobile and PC chips into server-class semiconductors, ZDNet Koreareported.
2026-06-22
www.digitimes.com
2026-06-22
digitimes
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS...
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2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
biz.chosun.com
2026-06-18
Chosunbiz
By
Jeong Du-yong
Published 2026.06.18. 06:02
Glass substrate from Appslix, SKC's semiconductor substrate manufacturing subsidiary./Courtesy of Appslix
TSMC, the world's largest foundry (contract semiconductor manufacturing) corporations, disclosed verification results for the commercialization of glass semiconductor substrates developed in an ecosystem centered on Taiwan and Japan. As a result,
2026-06-17
wccftech.com
2026-06-17
Wccftech
The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC
2026-06-16
www.digitimes.com
2026-06-16
digitimes
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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