Semiconductor News & Analysis Feed
70 articles
2026-07-21
digitimes.com
2026-07-21
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products expected with the DDR6 generation.
2026-07-18
digitimes.com
2026-07-18
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates remain widely used, but rising demand for high-density interconnects, lower signal loss, and better dimensional stability is pushing glass substrates closer to commercial adoption.
2026-07-16
digitimes.com
2026-07-16
As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies. At the heart of these optical engines, indium phosphide (InP) manufacturing is shifting toward larger 4-inch and 6-inch wafer production. While existing suppliers have yet to fully meet growing demand, Taiwanese c
2026-07-14
digitimes.com
2026-07-14
C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment demand. The PCB and semiconductor equipment maker said the outlook remained positive as foundry, outsourced semiconductor assembly and test, IC substrate, and high-end multilayer board customers increased capital
2026-07-14
digitimes.com
2026-07-14
Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new o
2026-07-14
digitimes.com
2026-07-14
The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects through higher costs, delayed capacity, and uneven access to advanced processors. As demand for CPUs, GPUs, and ASICs rises, ABF substrate supply is tightening, and the squeeze is expected to last for years.
2026-07-14
digitimes.com
2026-07-14
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing. The latest sales data suggest the upgrade cycle is broadening beyond one segment, with advanced ABF substrates and high-end CCL benefiting from higher specifications, better pricing, and rising AI content. For inves
2026-07-13
news.google.com
2026-07-13
Morningstar
2026-07-13
news.google.com
2026-07-13
PR Newswire
2026-07-13
news.google.com
2026-07-13
TradingView
2026-07-13
news.google.com
2026-07-13
PA Media
2026-07-12
digitimes.com
2026-07-12
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future supply as AI data center investment strains a concentrated photonics materials market.
2026-07-10
digitimes.com
2026-07-10
Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.
2026-07-10
digitimes.com
2026-07-10
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-10
bioengineer.org
2026-07-10
Bioengineer.org
The initial connection between Cloudflare's network and the origin web server timed out. As a result, the web page can not be displayed.
Contact your hosting provider letting them know your web server is not completing requests. An Error 522 means that the request was able to connect to your web server, but that the request didn't finish. The most likely cause is that something on your server is
2026-07-08
www.moomoo.com
2026-07-08
Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here.
Goldman Sachs remains cautious about Taiwan Semiconductor's (TSM.US) progress on glass core substrates (GCS), whil
2026-07-07
compoundsemiconductor.net
2026-07-07
Compound Semiconductor
News Article
Follow (3942) Tweet Share E-mail Add to reading list
Scrutinising 50 mm AlN substrates
Tuesday 7th July 2026
AlN substrates feature local variations in defect density and buried aluminium platelets
The recent availability of AlN substrates with diameters of up to 100 mm could be a game-changer for a number of compound semiconductor devices.
This foundation provides a native plat
2026-07-06
digitimes.com
2026-07-06
Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.