C Sun sees advanced packaging and PCB demand driving 2026 revenue

C Sun’s 2026 revenue roadmap signals a structural shift: AI infrastructure investment is migrating from chip design to back-end manufacturing. Surging demand for advanced packaging and high-end PCB equipment will force upstream material suppliers to accelerate development of low-loss dielectrics and HDI technologies, while pushing inspection and placement tools toward micron-level precision. Geopolitical headwinds loom—U.S. export controls on semiconductor equipment to China are tightening, compelling customers in Taiwan, China and mainland China to localize supply chains, raising near-term compliance costs but enhancing regional resilience long-term. Competitors like ASMPT and Kulicke & Soffa will likely accelerate HBM packaging tooling upgrades and may acquire niche PCB equipment firms to fortify moats. Over the next 18 months, capex in advanced packaging will outpace mature-node front-end spending, becoming the primary growth vector; second-tier vendors excluded from CoWoS or FOPLP ecosystems risk irreversible marginalization.