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Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications - digitimes

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www.digitimes.com 2026-09-04

Taiwan Semiconductor Manufacturing Company (TSMC)-affiliated Taisic Materials unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications such as smart grids, rail transportation, and high-power electrical systems. This development marks a signif

SiC substrate Power semiconductor Electric vehicle Smart grid Rail transportation Semiconductor material SiC technology Power electronics

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

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digitimes.com 2026-09-04

Zhen Ding Technology Unit to Invest 12 Billion Yuan in Advanced Packaging Substrate Base - marketscreener.com

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www.marketscreener.com 2026-09-03

Zhen Ding Technology's subsidiary has announced a RMB 12 billion investment to build an advanced packaging substrate production base. This significant move underscores China's continued investment in critical segments of the semiconductor supply chain, particularly in packaging technologies. As glob

Packaging Substrate Advanced Packaging Semiconductor Manufacturing Investment Plan Chinese Semiconductor Wafer Fab Chip Packaging Supply Chain Investment

Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan

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digitimes.com 2026-09-01

Glass Substrate: Comprehensive Industry Development Roadmap, Market Trends & Future Innovation Path - 36氪

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eu.36kr.com 2026-08-31

ABF substrate maker Unimicron searched in origin-labeling probe

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digitimes.com 2026-08-28

AI glass substrate race shifts toward reliability and mass production

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