Semiconductor News & Analysis Feed

Lam Research Corporation (LRCX) is expanding its presence in advanced packaging to meet the growing complexity and size of AI chips. The company established a Panel-Level Packaging (PLP) Center of Excellence in Salzburg, Austria, in May 2026 to accelerate research, customer qualification, and produc

Lam Research is expanding its advanced packaging opportunities as AI chips become larger and more complex. The company is focusing on Panel-Level Packaging (PLP) technology, establishing a Center of Excellence in Salzburg, Austria in May 2026 to accelerate research, customer qualification, and produ

Lam Research is expanding its advanced packaging capabilities as AI chips become increasingly complex and demanding. The company's establishment of a Panel-Level Packaging Center of Excellence in Salzburg, Austria in May 2026 represents a strategic move to capitalize on the growing demand for advanc

Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to mass-produce panel-level packaging (PLP), a next-generation chip packaging technology, setting up a direct showdown with Samsung Electronics. PLP uses large rectangular panels instead of traditional circular wafers, significantly impr

Manz Asia's successful delivery of the world's first 310mm×310mm panel-level packaging ECD (Electro-Chemical Deposition) production system represents a significant advancement in semiconductor packaging technology. This breakthrough enables larger panel sizes with enhanced precision, offering improv

ASE (Amkor Semiconductor Electronics) has launched automated 310mm panel-level packaging technology, marking a significant advancement in AI chip innovation. This breakthrough addresses the growing demand for high-performance, low-power chips in AI applications such as autonomous driving, cloud comp