Semiconductor News & Analysis Feed
541 articles
2026-07-04
marklapedus.substack.com
2026-07-04
Semiecosystem
2026-07-04
247wallst.com
2026-07-04
24/7 Wall St.
2026-07-03
www.thelec.net
2026-07-03
thelec.net
2026-07-03
digitimes.com
2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
digitimes.com
2026-07-03
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.
2026-07-03
digitimes.com
2026-07-03
TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now s
2026-07-03
newsletter.semianalysis.com
2026-07-03
SemiAnalysis
2026-07-03
tomshardware.com
2026-07-03
Anton Shilov
SK hynix announces major plan to spend $712.5 billion in its operations in South Korea, but the only detailed investments are spendings on a new NAND fab and a packaging facility.
2026-07-02
www.tradingview.com
2026-07-02
TradingView
2026-07-02
www.indexbox.io
2026-07-02
IndexBox
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2026-07-02
www.investing.com
2026-07-02
Investing.com
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2026-07-02
www.marketscreener.com
2026-07-02
marketscreener.com
2026-07-02
ca.investing.com
2026-07-02
Investing.com Canada
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2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes
NEWS PROVIDED BY
Nova
02 Jul, 2026, 14:30 IDT
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REHOVOT, Israel, July 2, 2026 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the selection of its Nova WMC™ platform by a leading global foundry customer for multiple layers' measurement in the most advanced packaging processes. The selection fol
2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes
NEWS PROVIDED BY
Nova
Jul 02, 2026, 07:30 ET
SHARE THIS ARTICLE
REHOVOT, Israel, July 2, 2026 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the selection of its Nova WMC™ platform by a leading global foundry customer for multiple layers' measurement in the most advanced packaging processes. The selection fol
2026-07-02
www.linkedin.com
2026-07-02
LinkedIn
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Everyone's talking about AI chips. But what makes those chips powerful in the first place?
‘Without advanced packaging, there is no AI,’ says Audrey Charles, SVP, Advanced Packaging & President, Lam Capital.
In this episode of Voices From The Valley, Audrey expla
2026-07-02
seekingalpha.com
2026-07-02
Seeking Alpha
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2026-07-02
www.mk.co.kr
2026-07-02
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2026-07-02
en.yna.co.kr
2026-07-02
Yonhap News Agency
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SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell
2026-07-02
letsdatascience.com
2026-07-02
Let's Data Science
INFRASTRUCTURE
hbm packaging
semiconductor investment
south korea
semiconductors
Samsung and SK hynix Build HBM Packaging Fabs
15 sources
|
July 2, 2026
|
By LDS Team
7.4
Relevance Score
Photo: newsimg.koreatimes.co.kr · rights & takedowns
QUICK SUMMARY
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Samsung Electronics and SK hynix will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a