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2026-07-22
NVIDIA, Wistron Kick Off Start of AI Supercomputer Factory in Fort Worth - Dallas Innovates
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dallasinnovates.com 2026-07-22 Dallas Innovates
2026-07-21
Siemens To Acquire Precision Innovations To Expand AI-Powered Chip Design Portfolio - Pulse 2.0
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pulse2.com 2026-07-21 Pulse 2.0
2026-07-21
URochester launches first NY THRIVE partnership to accelerate semiconductor innovation - University of Rochester
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www.rochester.edu 2026-07-21 University of Rochester
2026-07-21
Merck Electronics CEO Says Semiconductor Innovation Will Come From Advanced Packaging - 매일경제
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www.mk.co.kr 2026-07-21 매일경제
2026-07-21
Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design exploration and optimization - AiThority
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news.google.com 2026-07-21 AiThority
2026-07-21
Siemens to acquire chip design firm Precision Innovations - Star Local Media
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starlocalmedia.com 2026-07-21 Star Local Media
2026-07-20
Siemens to acquire Precision Innovations for chip design tools - Investing.com India
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in.investing.com 2026-07-20 Investing.com India
2026-07-20
Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design exploration and optimization - The AI Journal
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aijourn.com 2026-07-20 The AI Journal
2026-07-20
Siemens to acquire Precision Innovations for chip design tools By Investing.com - Investing.com Canada
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ca.investing.com 2026-07-20 Investing.com Canada
2026-07-20
Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design exploration and optimization - Yahoo Finance UK
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uk.finance.yahoo.com 2026-07-20 Yahoo Finance UK
2026-07-20
Ardian Semiconductor invests in VSORA, an innovative AI inference accelerator fabless company - WebWire
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www.webwire.com 2026-07-20 WebWire
2026-07-17
Intel Nova Lake leak points to Core Ultra Series 400 branding, staggered release next year
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tomshardware.com 2026-07-17 Kunal Khullar
Intel's upcoming Nova Lake desktop processors continue to gather momentum, with fresh reports hinting at Core Ultra Series 400 branding and a phased launch timeline.
IntelCPUNova LakeCore Ultra SeriesProcessor Architecture32-core28-core52-core
2026-07-17
FAST consortium secures $160m NSF funding to drive Oregon’s semiconductor industry - Innovation News Network
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www.innovationnewsnetwork.com 2026-07-17 Innovation News Network
2026-07-17
Submicron Aluminum Oxide Market To Reach New Heights by 2035 Amid Semiconductor Fab Expansion and CMP Slurry Innovation - News and Statistics - IndexBox
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www.indexbox.io 2026-07-17 IndexBox
2026-07-17
The Golden Age of Advanced Packaging: Key Innovations, Market Trends and Industry Growth Outlook - 36Kr
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eu.36kr.com 2026-07-17 36Kr
2026-07-17
Taiwan-Japan AI tech forum seeks closer partnerships
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digitimes.com 2026-07-17
A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI's global marketing chief and head of the organization's operations in Taiwan, told DIGITIMESbefore the event that IBM has already demonstrated 2nm chip
2026-07-16
Can Onto Innovation Extend Its Winning Streak in Advanced Nodes Business? - TradingView
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www.tradingview.com 2026-07-16 TradingView
2026-07-16
University of Arizona and TU/e unite to accelerate next-generation semiconductor technologies - Innovation News Network
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www.innovationnewsnetwork.com 2026-07-16 Innovation News Network
2026-07-16
Intel cuts planned TSMC 2nm orders for Nova Lake processors as 18A advances - Taiwan News
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www.taiwannews.com.tw 2026-07-16 Taiwan News
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
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digitimes.com 2026-07-16
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader mate