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2026-05-05
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX - CXOToday.com
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cxotoday.com 2026-05-05 CXOToday.com
2026-05-04
The competition in advanced packaging technology is intensifying! Intel's EMIB-T yield has reached 90%, potentially to be used in Google’s next-generation TPU. - Moomoo
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www.moomoo.com 2026-05-04 Moomoo
2026-05-04
MediaTek hires former TSMC executive to boost AI chip packaging - Reuters
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www.reuters.com 2026-05-04 Reuters
2026-05-04
Applied Materials to acquire NEXX advanced packaging unit By Investing.com - Investing.com South Africa
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za.investing.com 2026-05-04 Investing.com South Africa
2026-05-04
SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
Applied Materials to Acquire NEXX Business from ASMPT Limited, Expanding Advanced Packaging Portfolio for AI Technologies - Quiver Quantitative
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www.quiverquant.com 2026-05-04 Quiver Quantitative
2026-05-04
Applied Materials to acquire NEXX advanced packaging unit - Investing.com
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www.investing.com 2026-05-04 Investing.com
2026-05-04
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX - GlobeNewswire
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www.globenewswire.com 2026-05-04 GlobeNewswire
Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
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digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se